North America Integrated Die Packaging Technology Market

New York, May 27, 2021 (GLOBE NEWSWIRE) – Reportlinker.com announces the publication of the report “North America Embedded Die Packaging Technology Market Forecast to 2028 – COVID-19 Impact and Regional Analysis by Platform, Application, and Industry” – https: / /www.reportlinker.com/p06075740/?utm_source=GNW
The increasing developments in integrated die packaging technology are expected to accelerate the integrated die packaging technology market in North America. Integrated matrix packaging technology bridges the gap between traditional multi-chip modules (MCMs) and advanced 2.5-package solutions with an increased level of integration and a small form factor. The technology is not new to the packaging industry, but it is being adopted by niche applications due to technical challenges. However, the growing development of major manufacturers in North America, such as AT&S, GE, Shinko and ASE Group, is leading to its adoption for various applications. For example, ASE Group offers on-board die packaging technology for a wide range of applications such as smart homes, smart factories, smart automobiles, smart bikes and smart city devices. Wireless module, light module, sensor module, digital and processor module, and power management module are some of the application areas that are driving the growth of the North American market. Key factors increasing market growth over other packaging technologies include small form factor, thermal management, design flexibility, higher component integration, shorter interconnects, and protection against harsh environments. The integrated chip allows greater optimization of space through miniaturization and design flexibility. Shorter interconnects formed in integrated die packaging technology minimize distortion and power loss, while the lower thermal and electrical resistivity of the packaging type improves power performance. Embedded chip packaging technology has huge potential in the consumer electronics market, as it is used for a wide range of products, such as smartphones, smart speakers, smart cameras and more. other devices connected to the IoT. Increasing adoption of 5G network improves internet services and increases demand for supporting devices. In addition, the significant growth of IoT-based devices increases the demand for integrated matrix packaging technology for the North America region.

In the case of COVID-19, North America is badly affected, especially the United States. After the lockdown, the market saw an increasing demand for digital devices.

North America is among the most prominent regions to adopt smart or IoT-based devices due to favorable infrastructure support for high-speed internet services. 5G network adoption is believed to boost the market growth after foreclosure.

The COVID-19 outbreak is having a major impact on manufacturing facilities as production capacities have been reduced, and demand for electronics has remained constant, helping the market to resume growth.

For example, in December 2020, Qualcomm Inc, a leading microprocessor maker, predicted that 5G smartphone shipments will double in 2022, with the increasing deployment of the 5G network. Such Growing Adoption of 5G Smartphones Reduces Impact of COVID-19 for Post-Lockdown Period; while in foreclosure, it has certainly hampered the growth of the market.

Based on platform, IC package substrates segment dominated the on-board chip packaging technology market in North America in 2020.In semiconductor industry, integrated circuits use the On-board chip packaging technology to reduce size and improve performance.

In the IC package substrate platform, the semiconductor chip is embedded in standard PCB (printed circuit board) material, such as laminated layers and lead frames, at the time of forming the substrate. platform offers various advantages, such as miniaturization and design flexibility; improved reliability and mechanical stability; and improved thermal thermal and electrical performance.

IC package substrate platform in integrated die packaging technology is used for a wide range of applications, such as MOSFET, regulator, DCDC, audio, sensor, optics, connectivity, memory and imaging module. The above advantages offered by the IC package substrate are expected to increase its demand, thereby boosting the integrated die packaging technology market in North America.

The overall North America integrated chain packaging technology market size was calculated using primary and secondary sources To begin the research process, exhaustive secondary research was conducted using internal and external sources to obtain qualitative and quantitative information on the integrated chain in North America. packaging technology market.

The process also serves to gain overview and forecast for North America In-Vehicle Die Packaging Technology market with respect to all segments in the region.Moreover, multiple primary interviews were conducted with industry participants and commentators to validate the data, as well as to gain more analytical information on the topic.

Participants who typically participate in such a process include industry experts such as vice presidents, business development directors, business information directors and national sales directors as well as external consultants such as experts. in evaluation, research analysts and key opinion leaders specialized in North America. integrated matrix packaging technology market. Amkor Technology, Inc .; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd .; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; Shinko Electric Industries Co., Ltd .; and Taiwan Semiconductor Manufacturing Company, Limited are among the few players operating in the embedded chip packaging technology market in North America.
Read the full report: https://www.reportlinker.com/p06075740/?utm_source=GNW

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